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| CYStech Electronics Corp. PNP Epitaxial Planar Transistor Spec. No. : C599N3 Issued Date : 2005.12.30 Revised Date : Page No. : 1/4 BTA1542N3 Description * Large current capability * Low collector-to-emitter saturation voltage. * High speed switching. * Ultra-small package facilitates miniaturization in end products. * High allowable power dissipation. * Pb-free package Symbol BTA1542N3 Outline SOT-23 BBase CCollector EEmitter Absolute Maximum Ratings (Ta=25C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Base Current Power Dissipation Junction Temperature Storage Temperature DC Pulse Symbol VCBO VCEO VEBO IC ICP IB Pd Tj Tstg Limits -30 -20 -5 -3 -5 -600 0.9 (Note) 150 -55~+150 Unit V V V A mA W C C Note : When device mounted on a ceramic board (600mmx0.8mm) BTA1542N3 CYStek Product Specification CYStech Electronics Corp. Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO VCE(sat) 1 *VCE(sat) 2 *VBE(sat) hFE 1 fT Cob ton tstg tf Min. -30 -20 -5 200 Typ. 380 25 50 270 25 Max. -100 -100 -230 -155 -1.2 560 Unit V V V nA nA mV mV V MHz pF ns ns ns Spec. No. : C599N3 Issued Date : 2005.12.30 Revised Date : Page No. : 2/4 Test Conditions IC=-10A IC=-1mA IE=-10A VCB=-30V VEB=-4V IC=-1.5A, IB=-30mA IC=-1.5mA, IB=-75mA IC=-1.5A, IB=-30mA VCE=-2V, IC=-500mA VCE=-10V, IC=-500mA VCB=-10V, IE=0A,f=1MHz VCC=-12V, RL=24, IC=-20IB1=20IB2=-500mA *Pulse Test: Pulse Width 380s, Duty Cycle2% Ordering Information Device BTA1542N3 Package SOT-23 (Pb-free) Shipping 3000 pcs / Tape & Reel Marking SH BTA1542N3 CYStek Product Specification CYStech Electronics Corp. Reel Dimension Spec. No. : C599N3 Issued Date : 2005.12.30 Revised Date : Page No. : 3/4 Carrier Tape Dimension BTA1542N3 CYStek Product Specification CYStech Electronics Corp. SOT-23 Dimension Spec. No. : C599N3 Issued Date : 2005.12.30 Revised Date : Page No. : 4/4 A L 3 B 1 2 S Marking: Date code V G 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 Style: Pin 1.Base 2.Emitter 3.Collector C D K H J xx *: Typical Type name TE SH DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: * Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTA1542N3 CYStek Product Specification |
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